| US 7,372,697 B2 | ||
| Cooling device and electronic apparatus | ||
| Kentaro Tomioka, Sayama (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Jun. 23, 2006, as Appl. No. 11/473,777. | ||
| Claims priority of application No. 2005-192673 (JP), filed on Jun. 30, 2005. | ||
| Prior Publication US 2007/0002537 A1, Jan. 04, 2007 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. H05K 7/20 (2006.01); F28F 7/00 (2006.01) | ||
| U.S. Cl. 361—699 [361/689; 361/704; 165/80.4; 165/104.33] | 16 Claims |
| 1. A cooling device comprising:
a heat transfer unit including a passage, through which a coolant circulates in a first direction, a heat-receiving section
thermally connected to a heating element, and a heat-sinking section for dissipating heat received by the heat-receiving section,
wherein the heat transfer unit comprises a first plate member, in which a groove corresponding to the passage is formed, a
plurality of protrusions formed over a sidewall of the groove and each of the plurality of protrusions inclined so as to form
an obtuse angle between the sidewall and a surface of the protrusions in contact with the coolant flowing the first direction,
and a second plate member, which covers the groove, and
the heat-receiving section is formed on one of the first and second plate members.
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